https://pad.fs.lmu.de/c0Dy07VfROSvvobgldETcQ/
Over greater than 40 years of organic progress, AIT has developed some of the comprehensive lines of film and paste adhesives, enabling prospects to build merchandise with exceptional reliability and cost effectivity. Since pioneering low-modulus, low-stress adhesive paste and movie technologies, AIT has continued to broaden its offerings to include semiconductor and digital packaging adhesives, underfill supplies, encapsulants, and coating solutions. AIT has a proud historical past of offering leading edge options in digital packaging with
Like
Comment
Share
