https://www.selleckchem.com/products/unc-3230.html
Ag-Cu-Au ternary alloys are promising solder materials for wire bonding. Limited experimental studies on Ag-Cu-Au materials can be found due to the high cost of gold. In this study, face-centered-cubic Cu(10, Cu(111), and Cu(11 substrates wetted by molten Ag45Cu42Au13 were investigated via molecular dynamics (MD). As demonstrated by melting simulation results, the Ag45Cu42Au13 alloy has a lower melting temperature compared to the eutectic alloy, Ag60Cu40. MD methods were also used to investigate the dissolutive characteristics of A
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